GENEVIEVE PASCUAL

Accomplished Applications Engineer with extensive experience at MacDermid Alpha Electronic Solutions, specializing in solder joint reliability and continuous improvement. Proven expertise in ISO9001 standards and root cause analysis has resulted in significant enhancements in product quality and operational efficiency. Demonstrated leadership in laboratory improvements and process validation within fast-paced, lean environments drives successful outcomes. Aiming to leverage this expertise to further advance engineering excellence and operational performance.

• ISO 9001:2015 & ISO14001:2015, Neville Clarke, 05/01/17
• ISO 9001 & ISO 14001 Internal Auditor, Neville Clarke, 05/01/17
• Fundamentals of Thermal Analysis Course, Mettler Toledo, 07/01/15
• Globally Harmonized System (GHS) Chemical Users Course, 08/01/10
• Fire Fighting Course for Emergency Response Team (Building & Process Plant), 08/01/08

Visa Status: OPEN WORK VISA

• Exploring the Potential of LiDAR Camera Technology for Non-Intrusive Estimation of Grape Maturity, Massey University, 01/01/23 - 01/01/24, Explains the correlation of distance bias and light scattering (distortion) in depth scans with the water weight loss on table grapes to determine its maturity.
• Support to R&D, Alpha Advanced Materials, Provide support to R&D by performing applications and failure analysis tests on the newly formulated and developed paste flux and solder paste from lab scale to commercialization.
• Project Dalton1, 01/01/20, Next-generation fine powder water-soluble solder paste used on fine pitch components.
• Project Dalton2, 01/01/21 - 01/01/23, Next-generation fine powder water-soluble solder paste used on fine pitch components.
• Project Thompson, 01/01/19, WS698CPS, water-soluble solder paste for SiP and paste flux for flip chip used in today's LTE and next generation 5G in mobile phones.
• Project Boltzmann, 01/01/18, BM103LV, WS630 water-soluble paste flux compatible for laser soldering.
• Project Lavoisier, 01/01/18, NCX-402-M3 no-clean paste flux, high activity flux compatible for dipping applications on BGA components.
• Project Curie, 01/01/17, PRL-507 low residue epoxy for printing applications on wafer components.
• Project Darwin, 01/01/16, WSX-9284 water soluble paste flux, excellent in soldering and cleaning performance compatible with pin transfer, printing, and dipping methods on BGA and FCCSP components.

• Graduate of Masters of Engineering Studies with Merit
• Dissertation (published in MDPI) - Exploring the Potential of LiDAR Camera Technology for Non-Intrusive Estimation of Grape Maturity (published on MPDI). Explains the correlation of distance bias and light scattering (distortion) in-depth scans with the water weight loss on table grapes to determine its maturity.
• Winners Circle Achievement Award (Q3 2019) - awarded for innovative contributions and overall dedication in the development of WS698CPS (Water soluble paste flux and solder paste) used in LTE and next generation 5G mobile phones resulting in USD 660k in sales.
• Winners Circle Achievement Award (Q4 2020) - awarded for innovation and outstanding contributions throughout the development of WS699CPS "Next Generation" fine powder T5, T6 water soluble solder paste which achieved USD 770k in sales in 2020.