WANJIE LYU

I am a soon-to-be graduate in Computer Engineering from the University of Canterbury in New Zealand. During my academic career, I have received comprehensive training necessary for an engineer, including professional knowledge, teamwork, project management, and legal and ethical considerations. My studies have primarily focused on computer architecture, operating systems, digital and analogue circuit design, embedded systems, and communication engineering. Additionally, I have studied software engineering, network structures, and data security.
Throughout my time at university and during vacations, I have participated in several embedded projects, gaining a clear understanding of the entire development cycle from hardware to software. During vacations, I interned as a software engineer at a large enterprise in China and also at a power company in New Zealand. These experiences have given me a solid understanding of project development, management, and teamwork in real-world companies, laying a strong foundation for my future career.

Evaluation Criteria: Circuit Design, PCB Layout, EMC, and Overall Performance

Team Members: 4

Development Environment and Software: GitLab, VS Code, Altium Designer

Programming Language: C/C++

Hardware: 4-layer PCBs (2 units), H-bridge, SPI communication modules, JTAG, USB interface modules, battery modules, power regulators, buck converters, ADC modules, accelerometers, pressure sensors, LED strips, and other basic electronic components

My Roles and Contributions:

• Acted as the team leader, responsible for organizing meetings, finalizing plans, setting goals, planning schedules, and assigning tasks.
• Oversaw the entire project from requirement analysis and component selection to project delivery.
• Independently designed the circuit diagram and PCB layout for the remote car.
• Assisted in component soldering, MCU programming, and debugging.
• After completing the car, assisted with the debugging and testing of the controller board.

Project Summary: In the early stages of the project, our team leveraged strong foundational knowledge to successfully complete component selection, circuit design, and PCB layout. However, during the soldering process of the prototype, we encountered challenges: due to soldering limitations, some components such as the MOSI pin of the SPI communication module had poor soldering, affecting functionality. We quickly utilized software analysis, schematic review, hardware inspection, and tools like oscilloscopes to identify and resolve the issue, ensuring all board functions met the requirements.

Despite this, there were still areas for improvement in the PCB layout, such as the suboptimal placement of the power regulator for the SPI module, the close proximity of analog and digital circuits, and minor crosstalk in high-speed circuits. Additionally, voltage instability occurred when connecting multiple peripherals, but considering the time constraints and the limited size of the PCB, the results were still significant. This experience provided a deep understanding of the importance of PCB layout and precise soldering, accumulating valuable knowledge for future projects.

This is a large-scale IoT development project I participated in during my internship. The aim of the project was to connect various devices and facilities within a small community to improve the quality of life and ease of management. I was assigned to the software development team, primarily responsible for embedded software development, including driver writing, program development, and documentation.

Skills Applied:

• Knowledge of communication engineering
• Embedded hardware and software knowledge
• C/C++
• Team collaboration

Project Outcome: During the initial integration testing phase, we encountered some difficulties due to communication issues with the hardware team, which resulted in a one-week delay in the overall project delivery. However, the project was eventually delivered successfully and performed very satisfactorily.